【展商风采】北京晶飞半导体科技有限公司邀您参加第五届亚太碳化硅及相关材料国际会议

碳化硅激光垂直剥离设备

Silicon carbide laser vertical stripping equipment

碳化硅激光垂直剥离设备是用于第三代半导体材料（碳化硅）晶锭、晶片切割的加工设备，可用于对4/6/8寸晶锭进行加工。本设备采用高精度运动平台，搭配自研设计光路和控制软件实现智能路径规划和精密运动控制，通过视觉技术实现精准定位和全局实时监控，保证材料高效加工，损耗少，出片率高。

Silicon carbide laser vertical stripping equipment is a processing equipment for the third generation of semiconductor materials (silicon carbide) ingots and wafer cutting, which can be used to process 4/6/8 inch ingots. This equipment adopts a high-precision motion platform, with self-developed design optical path and control software to achieve intelligent path planning and precision motion control, and realizes precise positioning and global real-time monitoring through vision technology to ensure efficient material processing, low loss and high film yield